Check out some of my personal, educational, and professional milestones below!
Quantum Opus
I interned with Quantum Opus once full-time and once part-time. Quantum Opus creates superconducting nanowire single photon detectors. A device in an alignment mount is shown. I worked on a variety of projects mainly focused in mixed-signal, microwave, printed-circuit board layout for use at room temperature and in a cryogenic fridge. Check Quantum Opus out at https://www.quantumopus.com/web/. Keep scrolling to see my projects!
QOIO
An eight channel board capable of operating super conducting single-photon detectors (SNSPD).
Features of the board:
Two-stage LNA chain to amplify SNSPD output pulses
TTL comparators to digitize output pulses
Octal DAC to program comparator reference voltage
Bias chips to provide current for superconducting
FPGA to count amplifier output pulses
Level shifters to translate logic levels for I2C communication
Isolated analog and digital grounds to discourage high frequency switching noise
Large via count to lock down "ground islands"
Optional component pads for wideband inverting transformer
50 Ohm Impedance matched traces
On-board power regulation for ultra-quiet operation
QO Backplane
Digital backplane for interfacing with distributed electronics in Quantum Opus' Opus One.
Features of the board:
Slots to interface with bias card and amplifier card and support up to 64 channels of sensor electronics
Atmega64 microcontroller to run collect information from sensors and communicate with a laptop computer over USB
Thermometer readout interface
DC-DC power regulation
Cryogenic Amplifier
A high-density multi-channel amplifier layout for use in a cryogenic fridge.
Features of the board:
High-density cabling to transport up to 16 signals in parallel
Minimized circuit footprint to save space
Excellent crosstalk performance
Low Noise Amplifier Chain
A test board designed for Qorvo's SGL0622z LNA.
Features of the board:
Edge-mount SMA connectors to transfer signals on and off the board
Variable circuit architecture using solder jumpers to rapidly test multiple configurations
Exposed traces and pads for easy debugging
Device Mount
A new device mount design to increase the number of devices that can be placed on a single cold head.
Features of the architecture:
PCB designed to mount new multi-channel sensor
High density multi-channel cables
Increased device capacity from 16 to 128
